SEMI

国際半導体製造装置材料協会(国際半導体製造装置材料協会規格)

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SEMI(邦訳)リスト

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年号巻号分野
規格番号タイトルハンドブック情報
SEMI C1-88SPECIFICATIONS FOR REAGENTS19881Chemicals
SEMI C1 STD.1-85STANDARD FOR ACETIC ACID19881Chemicals
SEMI C1 STD.2-85STANDARD FOR ACETONE19881Chemicals
SEMI C1 STD.3-88STANDARD FOR AMMONIUM FLUORIDE 40% SOLUTION19881Chemicals
SEMI C1 STD.4-85STANDARD FOR AMMONIUM HYDROXIDE19881Chemicals
SEMI C1 STD.5-85STANDARD FOR n-BUTYL ACETATE19881Chemicals
SEMI C1 STD.6-85STANDARD FOR DICHLOROMETHANE(METHYLENE CHLORIDE)19881Chemicals
SEMI C1 STD.7-85STANDARD FOR HYDROCHLORIC ACID19881Chemicals
SEMI C1 STD.8-82STANDARD FOR HYDROFLUORIC ACID19881Chemicals
SEMI C1 STD.9-85STANDARD FOR HYDROGEN PEROXIDE19881Chemicals
SEMI C1 STD.10-85STANDARD FOR METHANOL19881Chemicals
SEMI C1 STD.11-85STANDARD FOR METHYL ETHYL KETONE19881Chemicals
SEMI C1 STD.12-85STANDARD FOR NITRIC ACID19881Chemicals
SEMI C1 STD.13-85STANDARD FOR PHOSPHORIC ACID19881Chemicals
SEMI C1 STD.14-85STANDARD FOR POTASSIUM HYDROXIDE PELLETS19881Chemicals
SEMI C1 STD.15-85STANDARD FOR 2-PROPANOL19881Chemicals
SEMI C1 STD.16-85STANDARD FOR SULFURIC ACID19881Chemicals
SEMI C1 STD.17-85STANDARD FOR TETRACHLOROETHYLENE19881Chemicals
SEMI C1 STD.18-85STANDARD FOR TOLUENE19881Chemicals
SEMI C1 STD.19-85STANDARD FOR TRICHLOROETHYLENE19881Chemicals
SEMI C1 STD.20-85STANDARD FOR TRICHLOROTRIFLUOROETHANE19881Chemicals
SEMI C1 STD.21-85STANDARD FOR XYLENES19881Chemicals
SEMI C1 STD.22-85STANDARD FOR SODIUM HYDROXIDE PELLETS19881Chemicals
SEMI C1 STD.23-86STANDARD FOR HEXAMITHYLDISILAZANE(HMDS)(PROPOSED)19881Chemicals
SEMI C1 STD.24-86STANDARD FOR 1,1,1-TRICHLOROETHANE、ELECTRONICS GRADE19881Chemicals
SEMI C1 STD.25-86STANDARD FOR 1-METHYL-2-PYRROLIDINONE19881Chemicals
SEMI C1 STD.26-88STANDARD FOR 1,1,1 TRICHLOROETHANE,FURNACE GRADE(PROPOSED)19881Chemicals
SEMI C2-86SPECIFICATIONS FOR ETCHANTS19881Chemicals
SEMI C2 STD.1-86STANDARD FOR MIXED ACID ETCHANTS19881Chemicals
SEMI C2 STD.2-86STANDARD FOR BUFFERED OXIDE ETCHANTS19881Chemicals
SEMI C2 STD.3-86STANDARD FOR PHOSPHORIC ETCHANTS19881Chemicals
SEMI C3-86SPECIFICATIONS FOR GASES19881Chemicals
SEMI C3 STD.1-88STANDARD FOR BULK LIQUID ARGON(Ar)19881Chemicals
SEMI C3 STD.2-88STANDARD FOR ARSINE(AsH3) IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.3-88STANDARD FOR HYDROGEN CHLORIDE(HCL) IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.4-88STANDARD FOR BULK LIQUID HYDROGEN(H2) (Proposed)19881Chemicals
SEMI C3 STD.5-88STANDARD FOR BULK LIQUID NITROGEN(N2) (Proposed)19881Chemicals
SEMI C3 STD.6-88STANDARD FOR PHOSPHINE(PH3) ELECTRONIC GRADE IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.7-88STANDARD FOR PHOSPHINE(PH3) LED GRADE IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.8-86STANDARD FOR SILANE(SiH4) EPITAXIAL GRADE IN CYLINDERS19881Chemicals
SEMI C3 STD.9-86STANDARD FOR SILANE(SiH4) POLYSILICON AND/OR SILICON DIOXIDE GRADE IN CYLINDERS19881Chemicals
SEMI C3 STD.10-86STANDARD FOR SILANE(sIH4) SILICON NITRADE GRADE IN CYLINDERS19881Chemicals
SEMI C3 STD.11-86STANDARD FOR SILICON TETRACHLORIDE(SiCl4) IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.12-86STANDARD FOR AMMONIA(NH3) IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.13-88STANDARD FOR NITROUS OXIDE(N2O) IN CYLINDERS(PROPOSED)19881Chemicals
SEMI C3 STD.14-84STANDARD FOR CARRIER GRADE ARGON (Ar) IN CYLINDERS19881Chemicals
SEMI C3 STD.15-84STANDARD FOR CARRIER GRADE NITROGEN(N2) IN CYLINDERS19881Chemicals
SEMI C3 STD.16-86STANDARD FOR ELECTRONIC GRADE OXYGEN(O2) IN CYLINDERS19881Chemicals
SEMI C3 STD.17-86STANDARD FOR MOS GRADE OXYGEN(O2) IN CYLINDERS19881Chemicals
SEMI C3 STD.18-86STANDARD FOR DICHLOROSILANE(H2SiCl2) IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.19-84STANDARD FOR CARRIER GRADE HYDROGEN(H2) IN CYLINDERS19881Chemicals
SEMI C3 STD.20-85STANDARD FOR HELIUM(He) IN CYLINDERS19881Chemicals
SEMI C3 STD.21-85STANDARD FOR CARBON TETRAFLUORIDE(CF4) IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.22-86STANDARD FOR BULK LIQUID OXYGEN(O2) IN CYLINDERS19881Chemicals
SEMI C3 STD.23-88STANDARD FOR OXYGEN(O2) VLSI GRADE、IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.24-88STANDARD FOR SULFUR HEXAFLUORIDE(SF6) IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.25-85STANDARD FOR HEXAFLUOROETHANE(C2F6) IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.26-84STANDARD FOR TUNGSTEN HEXAFLUORIDE(WF6) IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.27-88STANDARD FOR BORON TRIFLUORIDE(BF3) IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.28-85STANDARD FOR VLSI GRADE NITROGEN(N2) IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.29-86STANDARD FOR VLSI GRADE BULK GASEOUS NITROGEN19881Chemicals
SEMI C3 STD.30-86STANDARD FOR VLSI GRADE BULK HYDROGEN(H2) (PROVISIONAL)19881Chemicals
SEMI C3 STD.31-86STANDARD FOR (MOS GRADE)DICHLOROSILANE(H2SiCl2) IN CYLINDERS(PROVISIONAL)19881Chemicals
SEMI C3 STD.32-87STANDARD FOR CHLORINE(Cl2) (PROPOSED)19881Chemicals
SEMI C3 STD.33-87STANDARD FOR BORON TRICHLORIDE(BCL3) (PROPOSED)19881Chemicals
SEMI C3 STD.34-88STANDARD FOR DISILANE(Si2H6) (PROVISIONAL)19881Chemicals
SEMI C3 STD.35-88STANDARD FOR VLSI GRADE HYDROGEN CHLORIDE(PROVISIONAL)19881Chemicals
SEMI C4-82METHOD OF VISCOSITY DETERMINATION、METHOD A-KINEMATIC VISCOSITY19881Chemicals
SEMI C5-84METHOD FOR THE DETERMINATION OF WATER IN PHOTORESIST19881Chemicals
SEMI C6 STD.1-86PARTICLE SPECIFICATION FOR GRADE 20/0.2 NITROGEN AND ARGON DELIVERED AS PIPELINE GAS19881Chemicals
SEMI D1-85SPECIFICATION FOR PHYSICAL AND MECHANICAL CHARACTERISTICS OF 40mm×130mm FINISHED NICKEL PLATED SUBSTRATES FOR RIGID DISKS19883Materials
SEMI D1-85SPECIFICATION FOR PHYSICAL AND MECHANICAL CHARACTERISTICS OF 40mm×130mm FINISHED NICKEL PLATED SUBSTRATES FOR RIGID DISKS 19873MATERIALS
SEMI D2-86SPECIFICATION FOR ALUMINUM SUBSTRATES FOR RIGID DISKS19883Materials
SEMI D2-86SPECIFICATION FOR ALUMINUM SUBSTRATES FOR RIGID DISKS19873MATERIALS
SEMI D3-87SPECIFICATION VERTICVAL,UNIVERSAL CARRIERS FOR RIGD DISKS19882Equipment Automation
SEMI D3-87SPECIFICATION VERTICAL,UNIVERSAL CARRIERS FOR RIGID DISKS19872EQUIPMENT AUTOMATION
SEMI E1-86SPECIFICATION, 3"、100mm、125mm、AND 150mm PLASTIC AND METAL WAFER CARRIERS"19882Equipment Automation
SEMI E1-86SPECIFICATION, 3",100mm,125mm,AND 150mm PLASTIC AND METAL WAFER CARRIERS"19872EQUIPMENT AUTOMATION
SEMI E1 STD.1-86STANDARD, 3" PLASTIC AND METAL WAFER CARRIERS、GENERAL USAGE"19882Equipment Automation
SEMI E1 STD.1-86STANDARD, 3" PLASTIC AND METAL WAFER CARRIERS,GENERAL USAGE"19872EQUIPMENT AUTOMATION
SEMI E1 STD.2-86STANDARD, 100mm PLASTIC AND METAL WAFER CARRIERS、GENERAL USAGE19882Equipment Automation
SEMI E1 STD.2-86STANDARD, 100mm PLASTIC AND METAL WAFER CARRIERS,GENERAL USAGE19872EQUIPMENT AUTOMATION
SEMI E1 STD.3-86STANDARD, 125mm PLASTIC AND METAL WAFER CARRIERS、GENERAL USAGE19882Equipment Automation
SEMI E1 STD.3-86STANDARD, 125mm PLASTIC AND METAL WAFER CARRIERS,GENERAL USAGE19872EQUIPMENT AUTOMATION
SEMI E1 STD.4-86STANDARD, 125mm PLASTIC AND METAL WAFER CARRIERS、AUTO TRANSPORT USAGE19882Equipment Automation
SEMI E1 STD.4-86STANDARD, 125mm PLASTIC AND METAL WAFER CARRIERS,AUTO TRANSPORT USAGE19872EQUIPMENT AUTOMATION
SEMI E1 STD.5-86STANDARD, 150mm PLASTIC AND WAFER CARRIERS、GENERAL19882Equipment Automation
SEMI E1 STD.5-86STANDARD, 150mm PLASTIC AND METAL WAFER CARRIERS,GENERAL USAGE19872EQUIPMENT AUTOMATION
SEMI E2-86STANDARD, 125mm and 150mm QUARTZ AND HIGH TEMPERATURE WAFER CARRIERS19872EQUIPMENT AUTOMATION
SEMI E2 STD.1-86STANDARD, 125mm and 150mm QUARTZ AND HIGH TEMPERATURE WAFER CARRIERS19882Equipment Automation
SEMI E2 STD.1-86STANDARD, 125mm and 150mm QUARTZ AND HIGH TEMPERATURE WAFER CARRIERS19872EQUIPMENT AUTOMATION
SEMI E2 STD.2-86STANDARD, 125mm and 150mm QUARTZ AND HIGH TEMPERATURE WAFER CARRIERS19882Equipment Automation
SEMI E2 STD.2-88STANDARD, 200mm QUARTZ AND HIGH TEMPERATURE WAFER CARRIERS(Proposed)19882Equipment Automation
SEMI E3-83RECOMMENDED INSPECTION PROCEDURE 100mm QUARTZ WAFER CARRIERS19872EQUIPMENT AUTOMATION
SEMI E4-86EQUIPMENT COMMUNICATIONS STANDARD 1 MESSAGE TRANSFER(SECS-I)19872EQUIPMENT AUTOMATION
SEMI E4-87EQUIPMENT COMMUNICATIONS STANDARD 1 MESSAGE TRANSFER(SECS-I)19882Equipment Automation
SEMI E5-86EQUIPMENT COMMUNICATIONS STANDARD 2 MESSAGE CONTENT(SECS-II)19872EQUIPMENT AUTOMATION
SEMI E5-88EQUIPMENT COMMUNICATIONS STANDARD 2 MESSAGE CONTENT(SECS-II)19882Equipment Automation
SEMI E6-85FACILITIES INTERFACE SPECIFICATIONS FORMAT19882Equipment Automation
SEMI E6-85FACILITIES INTERFACE SPECIFICATIONS FORMAT19872EQUIPMENT AUTOMATION
SEMI E7-84SPECIFICATION, ELECTRICAL INTERFACES19882Equipment Automation
SEMI E7-84SPECIFICATION, ELECTRICAL INTERFACES19872EQUIPMENT AUTOMATION
SEMI E8-84SPECIFICATION, WAFER TRANSPORT SYSTEMS: INTERFACE COORDINATES19882Equipment Automation
SEMI E8-84SPECIFICATION, WAFER TRANSPORT SYSTEMS: INTERFACE COORDINATES19872EQUIPMENT AUTOMATION
SEMI E10-86GUIDELINE, EQUIPMENT RELIABILITY19882Equipment Automation
SEMI E10-86GUIDELINE, EQUIPMENT RELIABILITY19872EQUIPMENT AUTOMATION
SEMI E11-87GUIDELINE, 125MM PLASTIC AND METAL WAFER CARRIER APPLICATION19882Equipment Automation
SEMI E11-87GUIDELINE, 125 MM PLASTIC AND METAL WAFER CARRIER APPLICATION19872EQUIPMENT AUTOMATION
SEMI E12-86DEFINITION OF STANDARD TEMPERATURE AND PRESSURE FOR USE IN EXPRESSING THE VOLUMETRIC FLOW RATE OF MASS FLOW METERS AND MASS FLOW CONTROLLERS(PROPOSED)19882Equipment Automation
SEMI E12-86DEFINITION OF STANDARD TEMPERATURE AND PRESSURE FOR USE IN EXPRESSING THE VOLUMETRIC FLOW RATE OF MASS FLOW METERS AND MASS FLOW CONTROLLERS(PROPOSED)19872EQUIPMENT AUTOMATION
SEMI G1-85SPECIFICATION, CER-DIP BASES AND CAPS19884Packaging
SEMI G2-87SEPCIFICATION, METALLIC LEADFRAMES FOR CER-DIP PACKAGES19884Packaging
SEMI G3-85SPECIFICATION, SIDEBRAZED LAMINATES19884Packaging
SEMI G4-86SPECIFICATION, INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES(PROPOSED)19884Packaging
SEMI G5-87SPECIFICATION, CERAMIC CHIP CARRIERS19884Packaging
SEMI G6-83TEST METHOD, SEAL RING FLATNESS19884Packaging
SEMI G8-83TEST METHOD, GOLD PLATING QUALITY19884Packaging
SEMI G9-86SPECIFICATION, STAMPED LEADFRAMES FOR PLASTIC MOLDED SEMICONDUCTOR PACKAGES(PROPOSED)19884Packaging
SEMI G10-86STANDARD METHOD, MECHANICAL MEASUREMENT FOR PLASTIC PACKAGE LEADFRAMES19884Packaging
SEMI G11-88RECOMMEND PRACTICE, RAM FOLLOWER GEL TIME AND SPIRAL FLOW OF THERMAL SETTING MOLDING COMPOUNDS19884Packaging
SEMI G12-82RECOMMEND PRACTICE, AQUEOUS EXTRACTION OF IONIC SPECIES FROM PLASTICS USED TO PACKAGE ELECTRONIC DEVICES19884Packaging
SEMI G13-82STANDARD TEST METHOD, EXPANSION CHARACTERISTICS OF MOLDING COMPOUNDS19884Packaging
SEMI G14-88GUIDELINE SPECIFYING THE DIMENSIONS AND TOLERANCES USED TO MANUFACTURE PLASTIC MOLDED DIP PACKAGE TOOLING(PROPOSED)19884Packaging
SEMI G15-88STANDARD TEST METHOD, DIFFERENTIAL SCANNING CALORIMETRY OF MOLDING COMPOUNDS(PROPOSED)19884Packaging
SEMI G16-88SPECIFICATION, DIMENSIONS AND TOLERANCES USED TO MANUFACTURE PLASTIC CHIP CARRIER TOOLING19884Packaging
SEMI G18-86SPECIFICATION, INTEGRATED CIRCUIT LEADFRAME MATERIAL USED IN THE PRODUCTION OF ETCHED LEADFRAMES19884Packaging
SEMI G19-84SPECIFICATION, DIP LEADFRAMES PRODUCED BY ETCHING(PROPOSED)19884Packaging
SEMI G20-84SPECIFICATION, LEAD FINISHES FOR PLASTIC PACKAGES(ACTIVE DEVICES ONLY)19884Packaging
SEMI G21-84SPECIFICATION, PLATING INTEGRATED CIRCUIT LEADFRAMES19884Packaging
SEMI G22-86SPECIFICATION, CERAMIC PIN GRID ARRAY PACKAGES19884Packaging
SEMI G23-84TEST METHOD, MEASURING THE INDUCTANCE OF PACKAGE LEADS19884Packaging
SEMI G24-84TEST METHOD, MEASURING THE LEAD-TO-LEAD AND LOADIND CAPACITANCE OF PACKAGE LEADS19884Packaging
SEMI G25-84TEST METHOD, MEASURING THE RESISTANCE OF PACKAGE LEADS19884Packaging
SEMI G26-86SPECIFICATION, HERMETIC SLAM CHIP CARRIER LIDS19884Packaging
SEMI G27-85SPECIFICATION, FOR LEADFRAMES FOR PLASTIC MOLDED QUAD PACKAGES19884Packaging
SEMI G28-86SPECIFICATION, LEADFRAMES FOR PLASTIC MOLDED S.O.PACKAGES(PROPOSED)19884Packaging
SEMI G29-86TEST METHOD,TRACE CONTAMINANTS IN MOLDING COMPOUNDS19884Packaging
SEMI G30-87TEST METHOD, JUNCION-TO-CASE THERMAL RESISTANCE MEASUREMENTS OF CERAMIC PACKAGES19884Packaging
SEMI G31-86TEST METHOD, DETERMINING THE ABRASIVE CHARACTERISTICS OF MOLDING COMPOUNDS(PROPOSED)19884Packaging
SEMI G32-86GUIDELINE FOR UNENCAPSULATED THERMAL TEST CHIP19884Packaging
SEMI G33-86SPECIFICATION, PRESSED CERAMIC PIN GRID ARRAY PACKAGES19884Packaging
SEMI G34-86SPECIFICATION, CER-PACK PACKAGE CONSTRUCTIONS、INCLUDING LEADFRAMES、 SUITABLE FOR AUTOMATED ASSEMBLY BY END USERS(PROPOSED)19884Packaging
SEMI G35-87SPECIFICATION TEST METHODS FOR LEAD FINISHES ON SEMICONDUCTOR(ACTIVE) DEVICES19884Packaging
SEMI G36-88SPECIFICATION, DIMENSIONS AND TOLERANCES USED TO MANUFACTURE PLASTIC MOLDED HIGH DENSITY TAB QUAD SEMICONDUCTOR PACKAGE TOOLING19884Packaging
SEMI G37-88SPECIFICATION, DIMENSIONS AND TOLERANCES USED TO MANUFACTURE PLASTIC MOLDED SMALL OUTLINE PACKAGE TOOLING19884Packaging
SEMI G38-87TEST METHOD, STILL-AND FORCED-AIR JUNCTION-TO-AMBIENT THERMAL RESISTANCE MEASUREMENTS OF INTEGRATED CIRCUIT PACKAGES19884Packaging
SEMI G39-87SPECIFICATION, BRAZED LEAD FLATPACK CONSTRUCTIONS、INCLUDING LEADFRAMES、SUITABLE FOR AUTOMATED ASSEMBLY19884Packaging
SEMI G41-87SPECIFICATION, DUAL STRIP SOIC LEADFRAME19884Packaging
SEMI G42-88SPECIFICATION, THERMAL TEST BOARD STANDARDIZATION FOR MEASURING JUNCTION-TO-AMBIENT THERMAL RESISTANCE OF SEMICONDUCTOR PACKAGES19884Packaging
SEMI G43-87TES METHOD, JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS MOLDED-PLASTIC PACKAGES19884Packaging
SEMI G44-87SPECIFICATION, LEAD FINISHES FOR GLASS TO METAL SEAL CERAMIC PACKAGES(ACTIVE DEVICES ONLY)19884Packaging
SEMI G45-88RECOMMENDED PRACTICE, FLASH CHARACTERISTICS OF THERMOSETTING MOLDING COMPOUNDS19884Packaging
SEMI G46-88Test Method, Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits19884Packaging
SEMI G47-88Specification, Plastic Molded Quad Flat Pack Leadframes(Proposed)19884Packaging
SEMI M1-86SPECIFICATIONS FOR POLISHED MONOCRYSTALLINE SILICON WAFERS19883Materials
SEMI M1-86SPECIFICATIONS FOR POLISHED MONOCRYSTALLINE SILICON WAFERS19873MATERIALS
SEMI M1 STD.1-86STANDARD FOR 2 INCH POLISHED MONOCRYSTALLINE SILICON WAFERS19883Materials
SEMI M1 STD.1-86STANDARD FOR 2 INCH POLISHED MONOCRYSTALLINE SILICON WAFERS19873MATERIALS
SEMI M1 STD.2-86STANDARD FOR 3 INCH POLISHED MONOCRYSTALLINE SILICON WAFERS19883Materials
SEMI M1 STD.2-86STANDARD FOR 3 INCH POLISHED MONOCRYSTALLINE SILICON WAFERS19873MATERIALS
SEMI M1 STD.3-86STANDARD FOR 80mm POLISHED MONOCRYSTALLINE SILICON WAFERS19883Materials
SEMI M1 STD.3-86STANDARD FOR 80mm POLISHED MONOCRYSTALLINE SILICON WAFERS19873MATERIALS
SEMI M1 STD.4-86STANDARD FOR 90mm POLISHED MONOCRYSTALLINE SILICON WAFERS19883Materials
SEMI M1 STD.4-86STANDARD FOR 90mm POLISHED MONOCRYSTALLINE SILICON WAFERS19873MATERIALS
SEMI M1 STD.5-86STANDARD FOR 100mm POLISHED MONOCRYSTALLINE SILICON WAFERS(525μm Thickness)19883Materials
SEMI M1 STD.5-86STANDARD FOR 100mm POLISHED MONOCRYSTALLINE SILICON WAFERS(525μm Thickness)19873MATERIALS
SEMI M1 STD.6-86STANDARD FOR 100mm POLISHED MONOCRYSTALLINE SILICON WAFERS(625μm Thickness)19883Materials
SEMI M1 STD.6-86STANDARD FOR 100mm POLISHED MONOCRYSTALLINE SILICON WAFERS(625μm Thickness)19873MATERIALS
SEMI M1 STD.7-86STANDARD FOR 125mm POLISHED MONOCRYSTALLINE SILICON WAFERS19883Materials
SEMI M1 STD.7-86STANDARD FOR 125mm POLISHED MONOCRYSTALLINE SILICON WAFERS19873MATERIALS
SEMI M1 STD.8-86STANDARD FOR 150mm POLISHED MONOCRYSTALLINE SILICON WAFERS19883Materials
SEMI M1 STD.8-86STANDARD FOR 150mm POLISHED MONOCRYSTALLINE SILICON WAFERS19873MATERIALS
SEMI M1 STD.9-86STANDARD FOR 200mm POLISHED MONOCRYSTALLINE SILICON WAFERS19883Materials
SEMI M1 STD.9-86STANDARD FOR 200mm POLISHED MONOCRYSTALLINE SILICON WAFERS19873MATERIALS
SEMI M1.1 -85SPECIFICATIONS FOR ALPHA NUMERIC MARKING OF 100 MM,125 MM,AND 150 MM SILICON WAFERS19873MATERIALS
SEMI M1.1-88SPECIFICATIONS FOR ALPHANUMERIC MARKING OF SILICON WAFERS 19883Materials
SEMI M2-87SPECIFICATIONS FOR SILICON EXPITAXIAL WAFERS19883Materials
SEMI M2-87SPECIFICATIONS FOR SILICON EXPITAXIAL WAFERS19873MATERIALS
SEMI M3-83SPECIFICATIONS FOR POLISHED MONOCRYSTALLINE SAPPHIRE SUBSTRATES19873MATERIALS
SEMI M3-88SPECIFICATIONS FOR POLISHED MONOCRYSTALLINE SAPPHIRE SUBSTRATES19883Materials
SEMI M3 STD.1-83STANDARD FOR 1.5 INCH SAPPHIRE SUBSTRATES19883Materials
SEMI M3 STD.1-83STANDARD FOR 1.5 INCH SAPPHIRE SUBSTRATES19873MATERIALS
SEMI M3 STD.2-83STANDARD FOR 2 INCH SAPPHIRE SUBSTRATES 19873MATERIALS
SEMI M3 STD.2-88STANDARD FOR 2 INCH SAPPHIRE SUBSTRATES19883Materials
SEMI M3 STD.3-83STANDARD FOR 2.25 INCH SAPPHIRE SUBSTRATES19883Materials
SEMI M3 STD.3-83STANDARD FOR 2.25 INCH SAPPHIRE SUBSTRATES19873MATERIALS
SEMI M3 STD.4-83STANDARD FOR 3 INCH SAPPHIRE SUBSTRATES19873MATERIALS
SEMI M3 STD.4-88STANDARD FOR 3 INCH SAPPHIRE SUBSTRATES19883Materials
SEMI M3 STD.5-83STANDARD FOR 100 MM SAPPHIRE SUBSTRATES19873MATERIALS
SEMI M3 STD.5-88STANDARD FOR 100MM SAPPHIRE SUBSTRATES19883Materials
SEMI M3 STD.6-83STANDARD FOR 3 INCH RECLAIMED SAPPHIRE SUBSTRATES19873MATERIALS
SEMI M3 STD.6-88STANDARD FOR 3 INCH RECLAIMED SAPPHIRE SUBSTRATES19883Materials
SEMI M4-83SPECIFICATIONS FOR SOS EPITAXIAL WAFERS19873MATERIALS
SEMI M4-88SPECIFICATIONS FOR SOS EPITAXIAL WAFERS19883Materials
SEMI M6-85SPECIFICATIONS FOR SOLAR CELL GRADE SILICON SLICES 19883Materials
SEMI M6-85SPECIFICATIONS FOR SOLAR CELL GRADE SILICON SLICES19873MATERIALS
SEMI M6 STD.1-85STANDARD FOR 100mm POLYCRYSTALLINE SOLAR CELL GRADE SILICON SLICES(RECTANGULAR)19883Materials
SEMI M6 STD.1-85STANDARD FOR 100 MM POLYCRYSTALLINE SOLAR CELL GRADE SILICON SLICES(RECTANGULAR)19873MATERIALS
SEMI M6 STD.2-85STANDARD FOR 3 INCH MONOCRYSTALLINE SOLAR CELL GRADE SILICON SLICES19883Materials
SEMI M6 STD.2-85STANDARD FOR 3 INCH MONOCRYSTALLINE SOLAR CELL GRADE SILICON SLICES19873MATERIALS
SEMI M6 STD.3-85STANDARD FOR 100MM MONOCRYSTALLINE SOLA CELL GRADE SILICON SLICES19883Materials
SEMI M6 STD.3-85STANDARD FOR 100 MM MONOCRYSTALLINE SOLAR CELL GRADE SILICON SLICES19873MATERIALS
SEMI M6 STD.4-85STANDARD FOR 125MM MONOCRYSTALLINE SOLAR CELL GRADE SLICES19883Materials
SEMI M6 STD.4-85STANDARD FOR 125 MM MONOCRYSTALLINE SOLAR CELL GRADE SLICES19873MATERIALS
SEMI M6 STD.5-85STANDARD FOR 150MM MONOCRYSTALLINE SOLAR CELL GRADE SILICON SLICES19883Materials
SEMI M6 STD.5-85STANDARD FOR 150 MM MONOCRYSTALLINE SOLAR CELL GRADE SILICON SLICES19873MATERIALS
SEMI M7-82SPECIFICATIONS FOR POLISHED MONOCRYSTALLINE GADOLINIUM GALLIUM GARNET SLICES19883Materials
SEMI M7-82SPECIFICATIONS FOR POLISHED MONOCRYSTALLINE GADOLINIUM GALLIUM GARNET SLICES19873MATERIALS
SEMI M7 STD.1-82STANDARD FOR 2 INCH POLISHED MONOCRYSTALLINE GADOLINIUM GALLIUM GARNET SLICES19883Materials
SEMI M7 STD.1-82STANDARD FOR 2 INCH POLISHED MONOCRYSTALLINE GADOLINIUM GALLIUM GARNET SLICES19873MATERIALS
SEMI M7 STD.2-82STANDARD FOR 3 INCH POLISHED MONOCRYSTALLINE GADOLINIUM GALLIUM GARNET SLICES19883Materials
SEMI M7 STD.2-82STANDARD FOR 3 INCH POLISHED MONOCRYSTALLINE GADOLINIUM GALLIUM GARNET SLICES19873MATERIALS
SEMI M7 STD.3-82STANDARD FOR 100MM POLISHED MONOCRYSTALLINE GADOLINIUM GALLIUM GARNET SLICES(510μm THICKNESS)19883Materials
SEMI M7 STD.3-82STANDARD FOR 100 MM POLISED MONOCRYSTALLINE GADOLINIUM GALLIUM GARNET SLICES(510μm THICKNESS)19873MATERIALS
SEMI M8-84SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON TEST AND RECLAIMED TEST SLICES19883Materials
SEMI M8-84SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON TEST AND RECLAIMED TEST SLICES19873MATERIALS
SEMI M8 STD.1-85STANDARD FOR 2 INCH POLISHED MONOCRYSTALLINE SILICON TEST SLICES AND RECLAIMED SLICES19883Materials
SEMI M8 STD.1-85STANDARD FOR 2 INCH POLISHED MONOCRYSTALLINE SILICON TEST SLICES AND RECLAIMED SLICES19873MATERIALS
SEMI M8 STD.2-85STANDARD FOR 3 INCH POLISHED MONOCRYSTALLINE SILICON TEST SLICES AND RECLAIMED TEST SLICES19883Materials
SEMI M8 STD.2-85STANDARD FOR 3 INCH POLISHED MONOCRYSTALLINE SILICON TEST SLICES AND RECLAIMED TEST SLICES19873MATERIALS
SEMI M8 STD.3-85STANDARD FOR 100MM POLISHED MONOCRYSTALLINE SILICON TEST SLICES(525μm Thickness) AND RECLAIMED TEST SLICES19883Materials
SEMI M8 STD.3-85STANDARD FOR 100 MM POLISHED MONOCRYSTALLINE SILICON TEST SLICES(525μm Thickness) AND RECLAIMED TEST SLICES19873MATERIALS
SEMI M8 STD.4-85STANDARD FOR 100MM POLISHED MONOCRYSTALLINE SILICON TEST SLICES(625μm Thickness) AND RECLAIMED SLICES19883Materials
SEMI M8 STD.4-85STANDARD FOR 100 MM POLISHED MONOCRYSTALLINE SILICON TEST SLICES(625μm Thickness) AND RECLAIMED SLICES19873MATERIALS
SEMI M8 STD.5-85STANDARD FOR 125MM POLISHED MONOCRYSTALLINE SILICON TEST SLICES AND RECLAIMED SLICES 19883Materials
SEMI M8 STD.5-85STANDARD FOR 125 MM POLISHED MONOCRYSTALLINE SILICON TEST SLICES AND RECLAIMED SLICES19873MATERIALS
SEMI M8 STD.6-85STANDARD FOR 150MM POLISHED MONOCRYSTALLINE SILICON TEST SLICES AND RECLAIMED SLICES19883Materials
SEMI M8 STD.6-85STANDARD FOR 150 MM POLISHED MONOCRYSTALLINE SILICON TEST SLICES AND RECLAIMED SLICES19873MATERIALS
SEMI M9-86SPECIFICATIONS FOR POLISHED MONOCRYSTALLINE GALLIUM ARSENIDE SLICES19883Materials
SEMI M9-86SPECIFICATIONS FOR POLISHED MONOCRYSTALLINE GALLIUM ARSENIDE SLICES19873MATERIALS
SEMI M9 STD.1-86STANDARD FOR ROUND 2 INCH DIAMETER POLISHED MONOCRYSTALLINE GALLIUM ARSENIDE SLICES FOR INTEGRATED CIRCUIT APPLICATION19883Materials
SEMI M9 STD.1-86STANDARD FOR ROUND 2 INCH DIAMETER POLISHED MONOCRYSTALLINE GALLIUM ARSENIDE SLICES FOR INTEGRATED CIRCUIT APPLICATION19873MATERIALS
SEMI M9 STD.2-86STANDARD FOR ROUND 3 INCH DIAMETER POLISHED MONOCRYSTALLINE GALLIUM ARSENIDE SLICES FOR INTEGRATED CIRCUIT APPLICATION19883Materials
SEMI M9 STD.2-86STANDARD FOR ROUND 3 INCH DIAMETER POLISHED MONOCRYSTALLINE GALLIUM ARSENIDE SLICES FOR INTEGRATED CIRCUIT APPLICATION19873MATERIALS
SEMI M9 STD.3-86STANDARD FOR ROUND 2 INCH DIAMETER POLISHED MONOCRYSTALLINE GALLIUM ARSENIDE SLICES FOR OPTOELECTRONIC APPLICATIONS19883Materials
SEMI M9 STD.3-86STANDARD FOR ROUND 2 INCH DIAMETER POLISHED MONOCRYSTALLINE GALLIUM ARSENIDE SLICES FOR OPTOELECTRONIC APPLICATIONS19873MATERIALS
SEMI M9 STD.4-86STANDARD FOR ROUND 3 INCH DIAMETER POLISHED MONOCRYSTALLINE GALLIUM ARSENIDE SLICES FOR OPTOELECTRONIC APPLICATIONS19883Materials
SEMI M9 STD.4-86STANDARD FOR ROUND 3 INCH DIAMETER POLISHED MONOCRYSTALLINE GALLIUM ARSENIDE SLICES FOR OPTOELECTRONIC APPLICATIONS19873MATERIALS
SEMI M10-87STANDARD NOMENCLATURE FOR IDENTIFICATION OF STRUCTURES AND CONTAMINANTS SEEN ON POLISHED GaAs WAFERS19873MATERIALS
SEMI M10-88STANDARD NOMENCLATURE FOR IDENTIFICATION OF STRUCTURES AND CONTAMINANTS SEEN ON POLISHED GaAs WAFERS19883Materials
SEMI M11-88SPECIFICATIONS FOR SILICON EPITAXIAL WAFERS FOR ADVANCED APPLICATIONS19883Materials
SEMI M12-88SPECIFICATIONS FOR SERIAL ALPHANUMERIC MARKING OF TH FRONT SURFACE OFWAFERS(PROPOSED)19883Materials
SEMI P1-83SPECIFICATION, HARD SURFACE PHOTOMASK SUBSTRATES19885Micropatterning
SEMI P2-86 Table1TOTAL ALLOWABLE DEFECTS FOR UNSENSITIZED PHPTOPLATES19885Micropatterning
SEMI P2-86SPECIFICATION, CHROME THIN FILMS FOR HARD SURFACE PHOTOMASKS19885Micropatterning
SEMI P3-86 Table1TOTAL ALLOWABLE DEFECTS FOR SENSITIZED PHOTOPLATES19885Micropatterning
SEMI P3-86SPECIFICATION FOR PHOTORESIST/E-BEAM RESIST FOR HARD SURFACE PHOTOPLATES19885Micropatterning
SEMI P4-85 Table1DIMENSIONS FOR ROUND QUARTZ PHOTOMASK SUBSTRATES19885Micropatterning
SEMI P4-85 Table2FLATNESS LIMITS FOR ROUND QUARTZ PHOTOMASK SUBSTRATES19885Micropatterning
SEMI P4-85 Table3EDGE CRITERIA FOR ROUND QUARTZ PHOTOMASK SUBSTRATES19885Micropatterning
SEMI P4-85 Table4GLASS SUBSTRATE DEFECT LIMITS PER PLATE19885Micropatterning
SEMI P4-85SPECIFICATION FOR ROUND QUARTZ PHOTOMASK SUBSTRATES19885Micropatterning
SEMI P5-86SPECIFICATION FOR PELLICLES19885Micropatterning
SEMI P5 STD.1-86PELLICLES FOR USE IN POLYCHROMATIC(BROADBAND)、ONE-TO-ONE(1:1) STEPPER AND SCANNING MIRROR PROJECTION SYSTEMS19885Micropatterning
SEMI P5 STD.2-86PELLICLES FOR USE IN MONOCHROMATIC、SINGLE WAVELENGTH REDUCTION STEP AND REPEAT SYSTEMS19885Micropatterning
SEMI P6-88Specification Registration Marks for photomasks(Proposed)19885Micropatterning
SEMI P7-82METHOD OF VISCOSITY DETERMINATION、METHOD A-KINEMATIC VISCOSITY19885Micropatterning
SEMI P8-84METHOD FOR THE DETERMINATION OF WATER IN PHOTORESIST19885Micropatterning
SEMI P9-88GUIDELINE FOR FUNCTIONAL TESTING OF MICROELECTRONIC RESISTS19885Micropatterning